Principal Microelectronic Packaging Mechanical Design Engineer / Senior Principal Microelectronic Packaging Mechanical Design Engineer

29 May, 2024 trendhype.net 0 Comments 1 category
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Job title: Principal Microelectronic Packaging Mechanical Design Engineer / Senior Principal Microelectronic Packaging Mechanical Design Engineer

Company: Northrop Grumman

Job description: Mechanical Engineering, Electrical Engineering, Computer Engineering, Computer Science, or related technical fields… with NX or other 3D modeling software Preferred Qualifications: Advanced degrees in Mechanical Engineering, Electrical…

Expected salary: $93000 – 139600 per year

Location: Baltimore, MD

Job date: Sun, 26 May 2024 07:34:18 GMT

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